Nc-559-asm ครีมบัดกรีฟลักซ์ SMT PCB IC 100 กรัม
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100g NC-559-ASM Solder Paste Flux Cream SMT PCB IC Soldering Flux
Introduction:
Rework help paste applied to mobile phone PCB BGA and SMDs PGA etc.
Its used in low ionic activator system tin-run speed
Low level of smokesurface insulation resistance value is high residue after curing
Therefore the electrical properties of the cell phones and other communications products very little interference
Features:
NC-559 as a leave-in help paste residue color is very light there is a very high value of SIR
Recommended for BGA CSP and other solder ball array repair and fill the ball
When using smoke less no residue. Affordable.
Suitable for:
North and south bridge cards cell phone chip video chip BGA solder bumping
Also can use off the tin the effect is very ideal
The residue was less bright spot less smoke no pungent odor do not run the ball
Package included:1 PC
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